The growth mechanism of intermetallics between solders and metallized substrates, after thermal aging, are investigated. The solders used in this study are unleaded Sn-Cu-Ni solder and eutectic Pb-Sn solder. The Pt-Ag/Al2O3, Cu block and the electroless Cu/Pt-Ag/Al2O3 are employed as the metallized substrates. Microstructure evolution of the interfacial morphology, elemental, and phase distribution are probed with the aid of electron-probe microanalyzer (EPMA) and x-ray diffractometry. Two kinds of intermetallics, Cu3Sn and Cu6Sn5, are formed at the solder/Cu interface. However, for the solder/Pt-Ag system, only Ag3Sn is observed at the interface. The thickness of Cu3Sn, Cu6Sn5, and Ag3Sn compound layers for all solder/metallized substrate systems shows at t0.5 dependence at 100, 125, 150 and 170 C. According to the calculated activation energy and diffusion constant, the growth rate of Cu3Sn and Cu6Sn5 intermetallics in the electroless ***etallized substrate is relatively higher than that for Cu block one at the range of 100 C to 170 C. However, the growth rate of Cu6Sn5 and Ag3Sn is reduced in the Sn-Cu-Ni solder with respect to the eutectic Pb-Sn solder. On the other hand, the Sn-Cu-Ni solder system exhibits a thicker Cu3Sn intermetallic layer than the eutectic Pb-Sn solder after various aging times at 100 C. The thickness of Cu3Sn in the eutectic Pb-Sn solder is, however, thicker than that for Sn-Cu-Ni solder at 170 C.
Stick that in ya pipe and smoke it!
You have quite clearly stated that you have seen 170'c on a solar system which looks to be solder melting point!
Yes I've seen 170c on solar loops several times most have melted the AAV several times but never the solder. so stick that in pipe! BEPC boy
Here's a cut and paste for you.
SnSb5, tin with 5% of
antimony, is the
plumbing industry standard. Its melting point is 232-240 °C. It displays good resistance to
thermal fatigue and good
shear strength.
Here's another for you
Main article:
Solder
Soldering filler materials are available in many different
alloys for differing applications. In electronics assembly, the
eutectic alloy of 63% tin and 37% lead (or 60/40, which is almost identical in performance to the eutectic) has been the alloy of choice. Other alloys are used for plumbing, mechanical assembly, and other applications.
A eutectic formulation has several advantages for soldering; chief among these is the coincidence of the
liquidus and
solidus temperatures, i.e. the absence of a plastic phase. This allows for quicker wetting out as the solder heats up, and quicker setup as the solder cools. A non-eutectic formulation must remain still as the temperature drops through the liquidus and solidus temperatures. Any differential movement during the plastic phase may result in cracks, giving an unreliable joint. Additionally, a eutectic formulation has the lowest possible melting point, which minimizes heat stress on electronic components during soldering.
Common solder alloys are mixtures of tin and lead, respectively:
- 63/37: melts at 183 °C (361.4 °F) (eutectic: the only mixture that melts at a point, instead of over a range)
- 60/40: melts between 183–190 °C (361–374 °F)
- 50/50: melts between 185–215 °C (365–419 °F)
Lead-free solders are suggested anywhere children may come into contact with (since children are likely to place things into their mouths), or for outdoor use where rain and other precipitation may wash the lead into the groundwater.
Lead-free solder alloys melt around 250 °C (482 °F), depending on their composition.
For environmental reasons, 'no-lead' solders are becoming more widely used. Unfortunately most 'no-lead' solders are not eutectic formulations, making it more difficult to create reliable joints with them. See complete discussion below; see also
RoHS.
Other common solders include low-temperature formulations (often containing
bismuth), which are often used to join previously-soldered assemblies without un-soldering earlier connections, and high-temperature formulations (usually containing
silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations.
Alloying silver with other metals changes the melting point, adhesion and wetting characteristics, and tensile strength. Of all the brazing alloys, the silver solders have the greatest strength and the broadest applications.
[4]
Specialty alloys are available with properties such as higher strength, better electrical conductivity and higher corrosion resistance.
Oh and one final thing, Fernox technical told me their lead free solders melting point is 258c